Pasta HPX

Spetsifikatsioon tootele Heat transfer paste; silicon based; 1000g; PASTA HPX; 2.8W/mK

Operating temperature   -30...300°C

Kind of package   plastic container

Application   facilitates heat transfer

Thermal conductivity   2.8W/mK

Weight   1kg

Agent application   heatsinks

Agent features   silicon based

Name   PASTA HPX

Type of chemical agent   heat transfer paste

Appearance   paste

Dielectric constant   5.1

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